IEEE第三届电路、系统与器件（ICCSD 2019）

2019年IEEE第三届电路、系统与器件国际会议【IEEE ICCSD 2019】将于2019年8月23日至25日在【中国成都】举行。会议由IEEE，四川省电子学会，电子科技大学，东南大学，美国底特律大学支持，旨在为全世界科研学者、从业人员以及教育工作者提供一个最好的跨学科平台，探讨最近创新发明以及在电路设备与系统领域里面临的现实挑战与解决方法。我们诚挚地邀请您参与ICCSD 2019。

IEEE ICCSD 2019大会接收并注册的全文将被收录到IEEE会议论文集中，由【EI核心与Scopus】等检索。


*会议地点
成都西藏饭店
地址: 成都人民北路一段10号

 
*征稿主题（不限于以下)
请参考：http://iccds.org/call.html
Circuits, devices and systems
Smart grid and circuit
Signal and multimedia processing
Computers, software and applications
Ocean engineering and marine technology
Biomedical electronics and bioinformatics
Communication engineering
Electronics and electrical engineering
Computer science applications
Nano electro mechanical System
Photonics and optoelectronics
Networking, communication and multimedia
Information engineering
Wireless/Mobile communication and computing
Software specification and software assurance
Analysis of power quality and system stability
Assembly and packaging
Analog circuits and digital circuits
Antenna and propagation
Electric energy processing
Electromagnetic and photonics
Electro-optical phenomena of semiconductors
Power electronics and energy systems
Signal processing
Techniques of laser and applications Of electro-optics
Simulation of propagation
Battery management system
Circuits and electronics
Computer relaying integrated optics and electro-optics devices
Microwave theory and techniques
Microwave and millimeter
Modulation, coding, and channel analysis
Power electronics
Remote control and techniques of GPS
Robotics and atomization engineering
Signal integrity design for high-speed digital systems
Solar power generation
Wind power generation
Submission


*投稿方式
投稿系统：https://easychair.org/conferences/?conf=iccsd2019

*联系我们
会议秘书：罗女士
邮箱:iccsd@academic.net
电话：+86 (0)28 8652-8629


更多会议详情，请登陆 http://iccds.org/
 

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