2013自组装功能材料国际学术会议

 The International Conference on Self-assembled Functional Materials

The International Conference on Self-assembled Functional Materials

Date        : July 5 – July 7, 2013
Place       : Southeast University, Nanjing, China
Web site    : http://bimd.seu.edu.cn/conference/Home.html 
Chairpersons : Zhong-Ze Gu (Southeast University, China) 
Co-Chairpersons : Tomokazu Iyoda (Tokyo Institute of Technology, Japan)
Yadong Yin (University of California, Riverside, USA)

Invited Speakers:
Prof. Zhongqun Tian (Xiamen University, China)
Prof. Cefe López (Instituto de Ciencia de Materiales de Madrid, Spain)
Prof. Orlin D Velev (North Carolina State University, USA)
Prof. Yadong Yin (University of California, Riverside, USA)
Prof. Zhan Chen (University of Michigan, USA) 
Prof. Dayang Wang (University of South Australia, Australia) 
Prof. Daniel Ouyang (Lehigh University, USA) 
Prof. Bai Yang (Jilin University, China) 
Prof. Guangtao Li (Tsinghua University, China) 
Prof. Yanlin Song (Institute of Chemistry, CAS, China) 
Prof. Zhongze Gu (Southeast University, China) 
Prof. Zhenlin Wang (Nanjing University, China) 
Prof. Jian Zi (Fudan University, China) 
Prof. Tomokazu Iyoda (Tokyo Institute of Technology, Japan) 
Prof. Kimihisa Yamamoto (Tokyo Institute of Technology, Japan) 
Prof. Kithara Osakada (Tokyo Institute of Technology, Japan) 
Prof. Takanori Fukushima (Tokyo Institute of Technology, Japan) 
Prof. Takeo Yamaguchi (Tokyo Institute of Technology, Japan) 
Prof. Atsushi Shishido (Tokyo Institute of Technology, Japan) 
Prof. Keiji Nagai (Tokyo Institute of Technology, Japan) 
Prof. Osamu Sato (Kyushu University,Japan)

Background and Topics:
The “bottom up” self-assembly method has increasingly gotten scientists’ attention for effectively construction of nano- and micro-structural materials. And the self-assembled functional materials also have become the hot spot of research fields in chemistry, physics, biology, materials, microelectronics, and so on. The goal of this conference in to bring together the broad, multidisciplinary community of researchers who are interested in the field of self-assembled functional materials and the opportunities for future high-impact science and technology related to such field. The conference will provide a common forum for scientists operating in all the fields of self-assembled functional materials from their preparations to their properties and applications. The conference will primarily focus on the following topics that are of strong current interest in fields of self-assembled functional materials:

1)  Self-assembly of Colloidal Particles
2)  Photonic Crystals
3)  Molecule Self-assembly
4)  Photo-functional Materials and Devices
5)  Chemical and Biological Sensors
6)  Integrated material and bio-inspired material
7)  Others

Finally, new insights on short-term and future/futuristic device applications will be of prime interest in the framework of this Conference. 

Abstracts:
The science program committee will schedule both oral and poster sessions. Authors are requested to submit an extended abstract (maximum 2 pages, A4 size).  The deadline of submission is April 30, 2013. Since submitted papers will be selected and classified as oral or poster presentations on the basis of the abstracts, the abstracts should be as informative as possible. It is important to note that the abstracts should be clearly printed by a laser jet with one-inch margin on each side.

Language: 
The official language at this workshop is English.

Important Schedule:
Preliminary registration                May 15, 2013
Abstract (max. 2pages, A4 size)        April 30, 2013
Advanced registration                May 30, 2013
Conference                        July 5 – July 7, 2013

Program of the Workshop:
July 5 –July 7, 2013        Symposium
July 5: Registration, Night: welcome party
July 6: Presentation, Night: banquet
July 7: Presentation and Free discussion
July 8: Visiting time

Registration Fee: 
Foreign Participants: $300.00 ;
Domestic Participants: 
Teacher :￥1500.00;   Student :￥800 .00

Correspondences:
Hongmei Wei
Phone        : +86-25-83795632-602
FAX         : +86-25-83795635
E-mail        : hmwei@seu.edu.cn

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