2019年智能芯片设计与半导体电路国际会议（ICDSC 2019）
2019 International Conference on Intelligent Chip Design and Semiconductor Circuit(ICDSC 2019)
大会官网：http://www.engii.org/conference/ICDSC2019/
大会时间：2019年1月5-7日
大会地点：中国三亚
在线投稿：http://www.engii.org/RegistrationSubmission/default.aspx?ConferenceID=1095
邮箱投稿：math.jan@engii.org
录用通知：论文投稿后1周左右
△.文章出版
所有被会议录用的稿件将会发表在开源期刊"Journal of Applied Mathematics and Physics" , 被知网学术、谷歌学术等收录。
△. 本次会议征稿主题包含（但不限于）：
AI ChipDesign
Analog and mixed-signal circuits
Analog signal processing
Chip-to-chip communications
Circuit technologies
Circuits/devices modeling, verification and testing
Data converters and Data storage
Digital architectures and systems
Digital integrated circuits
Digital/synthesizable voltage regulators and plls
Emerging ic and system
Energy harvesting circuits and systems
Hardware-security circuits
High-bandwidth i/o interfaces
Image sensors and companion chips
Intra-chip communication circuits
Intelligent Chip
Memory design and Memory/ssd controllers
Memory-subsystem enhancements
Mems-based integrated systems
Micro-controllers and Microprocessors
Nano electronics circuits
Power control and management
Processing-in-memory
Processors/ multiprocessors
Reconfigurable architectures & FPGA-based designs
RF integrated circuits and microwave engineering
Sensor interface circuits
Special-purpose digital circuits
Subthreshold and near-threshold circuits
Switched-mode power supplies
System-level power management
Ultrasonic sensors, neural interfaces and closed-loop systems
Wide-bandgap-semiconductor
Wireless sensing, radar and localization
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