2013自组装功能材料国际学术会议【SCI Indexing】

发布时间:2013-03-04 16:18:50

Call for Papers

2013 International Conference on Self-assembled Functional Materials 

Date        : July 5 – July 7, 2013

Place       : Southeast University, Nanjing, China

Web site     : http://bimd.seu.edu.cn/conference/Home.html

Chairpersons : Zhong-Ze Gu (Southeast University, China)

Co-Chairpersons : Tomokazu Iyoda (Tokyo Institute of Technology, Japan)

Yadong Yin (University of California, Riverside, USA)

Co-organizer : Nano-Macro Materials, Devices, and System Research Alliance, Japan

Invited Speakers:

Prof. Zhongqun Tian (Xiamen University, China)

Prof. Cefe López (Instituto de Ciencia de Materiales de Madrid, Spain)

Prof. Orlin D. Velev (North Carolina State University, USA)

Prof. Yadong Yin (University of California, Riverside, USA)

Prof. Zhan Chen (University of Michigan, USA)

Prof. Dayang Wang (University of South Australia, Australia)

Prof. H. Daniel Ou-Yang (Lehigh University, USA)

Prof. Bai Yang (Jilin University, China)

Prof. Guangtao Li (Tsinghua University, China)

Prof. Yanlin Song (Institute of Chemistry, CAS, China)

Prof. Zhongze Gu (Southeast University, China)

Prof. Zhenlin Wang (Nanjing University, China)

Prof. Jian Zi (Fudan University, China)

Prof. Tomokazu Iyoda (Tokyo Institute of Technology, Japan)

Prof. Kimihisa Yamamoto (Tokyo Institute of Technology, Japan)

Prof. Kithara Osakada (Tokyo Institute of Technology, Japan)

Prof. Takanori Fukushima (Tokyo Institute of Technology, Japan)

Prof. Takeo Yamaguchi (Tokyo Institute of Technology, Japan)

Prof. Atsushi Shishido (Tokyo Institute of Technology, Japan)

Prof. Keiji Nagai (Tokyo Institute of Technology, Japan)

Prof. Osamu Sato (Kyushu University, Japan)

Prof. Susumu Kuwabata (Osaka University, Japan)

Prof. Wenlong Cheng (Monash University,Australia)

Background and Topics:

The “bottom up” self-assembly method has increasingly gotten scientists’ attention for effectively construction of nano- and micro-structural materials. And the self-assembled functional materials also have become the hot spot of research fields in chemistry, physics, biology, materials, microelectronics, and so on. The goal of this conference in to bring together the broad, multidisciplinary community of researchers who are interested in the field of self-assembled functional materials and the opportunities for future high-impact science and technology related to such field. The conference will provide a common forum for scientists operating in all the fields of self-assembled functional materials from their preparations to their properties and applications. The conference will primarily focus on the following topics that are of strong current interest in fields of self-assembled functional materials:

1)  Self-assembly of Colloidal Particles

2)  Photonic Crystals

3)  Molecule Self-assembly

4)  Photo-functional Materials and Devices

5)  Chemical and Biological Sensors

6)  Integrated material and bio-inspired material

7)  Others

Finally, new insights on short-term and future/futuristic device applications will be of prime interest in the framework of this conference.

Abstracts:

The science program committee will schedule both oral and poster sessions. Authors are requested to submit an extended abstract (maximum 2 pages, A4 size).  The deadline of submission is April 30, 2013. Since submitted papers will be selected and classified as oral or poster presentations on the basis of the abstracts, the abstracts should be as informative as possible. It is important to note that the abstracts should be clearly printed by a laser jet with one-inch margin on each side.

Language:

The official language at this conference is English.

Important Schedule:

Preliminary registration            May 15, 2013

Abstract (max. 2pages, A4 size)     April 30, 2013

Advanced registration             May 30, 2013

Conference                 July 5July 7, 2013

Program of the Conference:

July 5July 7, 2013    2013 ICSFM Conference

July 5: Registration, Night: welcome party

July 6: Presentation, Night: banquet

July 7: Presentation and Free discussion

July 8: Visiting time 

Registration Fee:

Foreign Participants: $300.00 ;

Domestic Participants:

Teacher :1500.00;   Student :800.00

Correspondences:

Hongmei Wei

Phone    : +86-25-83795632-602

FAX     : +86-25-83795635

E-mail    : hmwei@seu.edu.cn

 

 

附件:会议赞助展位邀请.doc

会议时间2013-07-05至2013-07-07
会议地点江苏南京
主办单位东南大学
联系人Hongmei Wei
电话+86-25-83795632-602
Emailhmwei@seu.edu.cn
会议规模200人以上
官方网址http://bimd.seu.edu.cn/conference/Home.html

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